| S. No. | Centre Name | Research Verticals | Thrust Areas |
|---|
| 10 | DIA-COE, IIT Hyderabad | 1. Ultra- High Temperature Materials for Hypersonic Applications (UHTM) | 1. UHTCMC (Carbon Fibre - Ceramic Matrix Composites) |
| | | | 2. SiC Fiber Indigenization |
| | | | 3. Alumina Zirconia & SiC Fibre Composite for Structural Applications |
| | | | 4. High Temperature Adhesive Materials |
| | | | 5. High Temperature Coatings |
| | | | 6. Liquid Precursor for Boron Nitride Matrix |
| | | | 7. Stealth Material for High Temperature Applications |
| | | | 8. EM window for Temperature from 16000C upto 25000C |
| | | 2. Artificial Intelligence for Missile and Missile Defence (AIMMD) | 1. AI for Performance Analysis, Verify Design and Operations of Missiles |
| | | | 2. AI For Data Validation of Phase Check Data of Missile and Missile Defence Systems |
| | | | 3. AI for Long Term Storage Health Monitoring |
| | | | 4. AI for Automatic Design of Missiles |
| | | | 5. Expert System for Inflight Mode Selection and Mission Management |
| | | | 6. Expert System for Threat Assessment and Weapon Assignment (TAWA) |
| | | | 7. High Entropy Expert Systems based TAWA (Maximising Unpredictability for Adversaries and Presenting Maximum Options Post Defence Action) |
| | | 3. Space Systems for Defence (SSD) | 1. Self-Deploying and Unfolding Structures |
| | | | 2. Power and Thermal Management Systems. |
| | | | 3. Space Robotics Platform. |
| | | | 4. Adoption of Technologies for Space Applications- Sensors, Radar, Optical, Communication, Electronic Warfare, Energy Storage, Mata-materials, Tracking Systems etc. |
| | | | 5. Defence Mechanism for Satellites. |
| | | | 6. Space Debris Modelling and its management |
| | | 4. Adaptive Imaging and Image Processing (AIIP) | 1. AI/ML based Image Processing. |
| | | | 2. Processing of Hyperspectral, Multispectral, SAR and Optical, Images for Complex Target Monitoring. |
| | | | 3. On Board Generation of High Value and Small Volume Summery. |
| | | 5. Nano-Ornithopter Technologies (NOTT) | 1. Material for Nano-Ornithopter Flapping Wing Configurations. |
| | | | 2. Flight Control and Related Technologies for Nano-Ornithopter. |
| | | | 3. Testing Methodologies |
| | | | 4. Sensors and Payloads for Nano-Ornithopters. |
| | | | 5. Swarm Applications for Nano-Ornithopters. |
| | | | 6. System Integration and Mission Profile & System Definition Validation |
| | | 6. Seeker and Homing Technologies (SHT) | 1. Novel Design and Fabrication of Active and Passive Seekers. |
| | | | 2. Advanced Homing Technologies. |
| | | | 3. AI/ML based Processing Devices & Algorithms Technologies for Seeker. |
| | | | 4. Compressive Sensing based Wide Open Sub-Nyquist Frequency Estimation |
| | | 7. Additive Manufacturing (AM) | 1. AM Process Optimization for Defence Components. |
| | | | 2. Directed Energy Deposition and Powder Bed Fusion Equipment Design. |
| | | | 3. Modelling & Simulation for Additive Manufacturing Processes. |
| | | | 4. Structural Components Manufacturing by AM. |
| | | | 5. AM for Single Use Components |
| | | | 6. AM for Prolonged Use Components. |
| | | | 7. Defence Standard for Additive Manufacturing Processes, Materials and Products. |
| | | | 8. Wire Arc Additive Manufacturing for Large-Scale Parts |
| | | | 9. Cold Spray Additive manufacturing |
| | | | 10. Micro/Nano AM with smart materials |
| | | | 11. Hybrid additive/subtractive machines |
| | | | 12. Superscalable volumetric AM technologies |
| | | | 13. Real Time Defect Monitoring and Process Control |
| | | 8. Laser Beam Combining based Communication, Power Transmission and Manufacturing (LBC) | 1. Manufacturing Technologies using Lasers |
| | | | 2. Spatial and Temporal Wave Front Control |
| | | | 3. Laser based Wireless Charging |
| | | | 4. Free Space Laser Communication |
| | | | 5. Laser Beam Profile Optimization for AM |
| | | | 6. Optical Phased Arrays |
| | | | 7. Photonic Lanterns |
| | | 9. Extraction, Recycling and Sustainability of Materials (ERSM) | 1. Extraction of Metals from Ores |
| | | | 2. Recovery of Materials from Process Scrap and End of Life Parts |
